Abstract
Comparative studies of the thickness of coatings of such metals as Cu, Ag, Cr, Co, and also Mn4 Si7 on polished substrates made of Si, Si O2 / Si structure, ST - 50 glass ceramic, mica were carried out. The coatings were deposited in vacuum using thermal evaporation and magnetron sputtering. The thickness and uniformity of deposited coatings on rotating substrates are estimated by optical measurements and computer simulation. Mathematical models for the formation of coatings on flat substrates have been developed. The possibility of the optimal position of the substrate for the formation of functional coatings uniform in thickness is shown.
The paper shows the theoretical and experimental calculations of C ++ Builder 6, designed to calculate the thickness and uniformity of vacuum coatings, allows you to evaluate their thickness and uniformity. To evaluate the uniformity of metal and semiconductor coatings in thickness, it is recommended to use modeling in C ++ Builder 6. The program allows you to obtain the distribution of the thickness of a coating of metal, semiconductor and other materials in the plane in Cartesian or cylindrical coordinates. The carried out research and calculations based on computer simulation make it possible to recommend the use of an inclined rotating disk, displaced relative to the evaporator, as a vacuum tooling.
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References
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Recommended Citation
Igamov, Bahrom; Bekpulatov, Ilkhom; Kamardin, Aleksey; Kamilov, Tulkun; Turapov, Ilhom; and Igamova, D
(2021)
"EVALUATION OF THE THICKNESS OF VACUUM METAL AND SEMICONDUCTOR COATINGS USING COMPUTER PROGRAMS,"
Technical science and innovation: Vol. 2021:
Iss.
4, Article 6.
DOI: https://doi.org/10.51346/tstu-01.21.4-77-0147
Available at:
https://btstu.researchcommons.org/journal/vol2021/iss4/6